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Search Results
| Name | Grades | Rating | |||
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Not teaching in Spring 2026 | |||||
MECH 5373 (Overall) | |||||
A- | |||||
MECH 5373 Xianming Dai | |||||
A- | |||||
Search Results
| Name | Grades | Rating | |||
|---|---|---|---|---|---|
Not teaching in Spring 2026 | |||||
MECH 5373 (Overall) | |||||
A- | |||||
MECH 5373 Xianming Dai | |||||
A- | |||||
Thermal Management of Microelectronics
MECH 5373
Erik Jonsson School of Engineering and Computer Science
To provide an introduction to thermal phenomena occurring in electronic equipment and to provide an understanding of how basic heat transfer principles can be applied to the thermal design of electronic packages. The course will commence with an introduction to the fundamentals of different heat transfer modes. The calculation of heat loads and temperature fields will be discussed using different cooling techniques. Includes parameter evaluation and design studies for single- and multi-chip modules, printed circuit board, and high-heat-flux cooling. 3 credit hours.
Prerequisites: MECH 3320 and MECH 3351 and MECH 4310.
Offering Frequency: Based on student interest and instructor availability
Grades: 54
Median GPA: A-
Mean GPA: 3.668
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Thermal Management of Microelectronics
MECH 5373
Erik Jonsson School of Engineering and Computer Science
To provide an introduction to thermal phenomena occurring in electronic equipment and to provide an understanding of how basic heat transfer principles can be applied to the thermal design of electronic packages. The course will commence with an introduction to the fundamentals of different heat transfer modes. The calculation of heat loads and temperature fields will be discussed using different cooling techniques. Includes parameter evaluation and design studies for single- and multi-chip modules, printed circuit board, and high-heat-flux cooling. 3 credit hours.
Prerequisites: MECH 3320 and MECH 3351 and MECH 4310.
Offering Frequency: Based on student interest and instructor availability
Grades: 54
Median GPA: A-
Mean GPA: 3.668
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